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Sub-100nm Non-Planar 3D InGaAs MOSFETs: Fabrication and Characterization
2012
ECS Transactions
InGaAs MOSFETs have been considered promising candidate for post-Si logic devices beyond 14nm technology node. To meet the increasing demand in electrostatic control at sub-100nm channel lengths, non-planar 3D structures have been introduced to the fabrication of InGaAs MOSFETs. In this paper, the fabrication and characterization of various non-planar 3D InGaAs MOSFETs have been demonstrated and summarized, including InGaAs heterostructure FinFETs, InGaAs-on-nothing nanowire MOSFETs, and InGaAs
doi:10.1149/1.3700471
fatcat:sbs7ox4gkvguxh4rpoye3vz46m