A 3D hermetic packaging technique suitable for capacitive MEMS sensors is studied. The encapsulation cap with a silicon vertical feedthrough and good surface ...
Dec 28, 2018 · A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive microelectromechanical systems (MEMS) sensors is studied.
Dec 21, 2018 · A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive microelectromechanical systems (MEMS) sensors is studied ...
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Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via. Meng ZhangJian Yang +5 authors. Jin Ning. Engineering ...
In this paper, we present a three-dimensional (3D) vacuum packaging technique at a wafer level for a radio frequency micro-electromechanical system (RF ...
Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via. Sensors 2019, 19, 93. https://doi.org/10.3390/s19010093.
In this paper, we present a three-dimensional (3D) vacuum packaging technique at a wafer level for a radio frequency micro-electromechanical system (RF MEMS) ...
A novel wafer-level three-dimensional (3D) encapsulation structure was designed for radio-frequency microelectromechanical system (RF MEMS) infrared ...
The glass-based process is more straightforward, without the need to deposit an insulating layer on the inner wall of the TGV, making the manufacturing cost of ...
Bibliographic details on Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via.