Abstract: Vertical integration of active device layers in the third dimension makes room for significant reduction in interconnect lengths leading to ...

A trade-off between reducing the total interconnect delay in critical paths while reducing the inter-stratal communication is proposed to address layer ...

ABSTRACT. Vertical integration of active device layers in the third dimension makes room for significant reduction in interconnect lengths lead-.

Abstract. Vertical integration of active device layers in the third dimension makes room for significant reduction in interconnect lengths leading to ...

M. Mukherjee's 5 research works with 47 citations and 127 reads, including: On physical-aware synthesis of vertically integrated 3D systems.

On physical-aware synthesis of vertically integrated 3D systems. M Mukherjee, R Vemuri. 18th International Conference on VLSI Design held jointly with 4th …, ...

We extend the scope of our work to address behavioral synthesis for vertically integrated three-dimensional systems and propose a methodology to perform ...

M. Mukherjee and R. Vemuri, “On Physical-Aware Synthesis of Vertically Integrated 3D Systems,” in Proc. International. Conference on. VLSI Design 2005. V.

On Physical-Aware Synthesis of Vertically Integrated 3D Systems pp. 647-652. Energy Efficient Hardware Synthesis of Polynomial Expressions pp. 653-658.

Oct 11, 2004 · We address the layer assignment problem as a part of a physical aware behavioral synthesis flow. We propose a 0-1 linear program formulation to ...