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Distributed Artificial Intelligence: Third International Conference, DAI 2021, Shanghai, China, December 17–18, 2021, Proceedings. Computing methodologies.
Jan 11, 2022 · The conference proceeding DAI 2021 presents topics such as reinforcement learning, distributed learning systems, deep learning and much ...
$63.69
This book constitutes the refereed proceedings of the Third International Conference on Distributed Artificial Intelligence, DAI 2021, held in Shanghai, ...
$66.49
This book constitutes the refereed proceedings of the Third International Conference on Distributed Artificial Intelligence, DAI 2021, held in Shanghai, ...
Distributed Artificial Intelligence: Third International Conference, DAI 2021, Shanghai, China, December 17–18, 2021, Proceedings

Distributed Artificial Intelligence: Third International Conference, DAI 2021, Shanghai, China, December 17–18, 2021, Proceedings

Book
This book constitutes the refereed proceedings of the Third International Conference on Distributed Artificial Intelligence, DAI 2021, held in Shanghai, China, in December 2021.The 15 full papers presented in this book were carefully reviewed and... Google Books
Originally published: January 11, 2022
Distributed Artificial Intelligence - Third International Conference, DAI 2021, Shanghai, China, December 17-18, 2021, Proceedings. Lecture Notes in ...
$7,693.00
Distributed Artificial Intelligence: Third International Conference, Dai 2021, Shanghai, China, December 17-18, 2021, Proceedings (Paperback).
$69.99
This book constitutes the refereed proceedings of the Third International Conference on Distributed Artificial Intelligence, DAI 2021, held in Shanghai,
Proceedings of the 3rd International Conference on Distributed Artificial Intelligence (DAI 2021) ... The 3rd DAI conference was held in Shanghai, China, in Dec.
Missing: Third December
Buy Distributed Artificial Intelligence: Third International Conference, DAI 2021, Shanghai, China, December 17-18, 2021, Proceedings by Jie Chen (Editor), ...
Distributed Artificial Intelligence : Third International Conference, DAI 2021, Shanghai, China, December 17-18, 2021, Proceedings. Format. Trade Paperback.