In this work, a novel high-Q dual-mass MEMS TFG with 3D wafer-level packaging is reported. Compared with conventional TFGs, a symmetrically decoupled lever ...
Moreover, a novel 3D packaging technique is used to realize high Q-factors. A composite substrate encapsulation cap, fabricated by through- ...
It is shown that a high-reliability electrical connection, together with a high air impermeability package, can be fulfilled with this 3D packaging technique.
It is shown that a high-reliability electrical connection together with a high-air-impermeability package can be fulfilled with this 3D packaging technique.
Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This work proposes and experimentally demonstrates a novel high-Q ...
Jul 12, 2021 · In this work, a novel high-Q dual mass MEMS TFG with 3D wafer-level packaging is reported. Compared with conventional TFGs, a symmetrically- ...
Round 1. Reviewer 1 Report. This paper describes the development of a gyroscope using 3D wafer-level packaging. I believe it is worth to be published.
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Nov 13, 2022 · A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope ( ...
Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging · Sensors ( IF 3.9 ) Pub Date : 2021-09-26 , DOI: 10.3390/s21196428
"A novel high-Q dual-mass MEMS tuning fork gyroscope based on 3D wafer-level packaging." Sensors21.19 (2021): 6428. Wang, Hao, et al. "A wafer-level vacuum ...